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Microelectronics Analytical Services

Do you need microelectronics analytical services with a fast turnaround from a source you can trust?  Get the answers you need with visual proof and in-depth analysis to support the results.

FAILURE ANALYSIS

FAILURE ANALYSIS

You receive a comprehensive failure analysis with recommendations and visual proof to understand and correct the root cause of your electronics failure. Fast turnaround.

REVERSE ENGINEERING

REVERSE ENGINEERING

You will get reverse engineering tailored to your needs, budget, and schedule. Bring your manufacturing state-side, protect your patents/IP, replace obsolete parts, etc.

LITIGATION SUPPORT

LITIGATION SUPPORT

You need evidence to protect your intellectual property and patents. We have the expertise and equipment to dig into electronic components to get you that evidence.

Devices & Technology

 

Z

Application Specific Integrated Circuit (ASIC)

Z

Semiconductors

Z

PCBs

Z

Discretes

Z

MEMS

Z

MOSFETs

Z

Medical Devices

Z

Cell Phones

Z

TVs

Z

Passives

Z

CMOS

Z

Laser Diodes

Capabilities & Equipment

If your bottom line depends on high-quality analytical services, then a strong lab is your advantage. Choose an electronics analytical lab with a comprehensive set of analytical tools and techniques.

Non-Destructive

  • Bench-top testing:  Curve Tracers, Logic Analyzer & Data Generator, Oscilloscope, etc.
  • Internal and external visual inspections
  • Acoustic Microscopy inspection
  • Real-Time X-ray Inspection
  • IR Microscopy (Thermal imaging)
  • X-ray Fluorescence (XRF)
  • Micro-FTIR (Organic substance identification)

Printed Circuit Board Assemblies

  • Visual Inspection (based on IPC specifications)
  • Cross-Sectioning
  • Potted Cross-Sectioning
  • Thermal (IR) Imaging
  • Dye and Pry (BGA package) Solderability Analysis
  • Hi-Pot & Insulation Resistance Testing
  • Heat Resistance, Solderability, etc.
  • High-speed & Low-Speed, Diamond Saws
  • Parallel Lapping

ICs, Discretes, Semiconductors

  • Cross-Sectioning
  • Potted Cross-Sections
  • Deprocessing – wet, dry and parallel lapping
  • Plastic Package Decappers 
  • Probe Station 
  • IR (thermal) Microscopy
  • SEM Inspection 
  • Focused Ion Beam (FIB) editing
  • FIB Cross-Sections
  • FIB TEM Prep and STEM/TEM Imaging
  • Photon Emission Microscopy (PEM aka LEM and EMMI)
  • Dry etching (oxides and package decaps)
  • SIMS and TOF-SIMS

Counterfeit Analysis

  • Visual Inspection: Device markings, dimensions, lead finish, remarking
  • Datasheet comparison
  • X-Ray inspection
  • XRF inspection (RoHS)
  • Acoustical inspection
  • Decapsulation
  • Die inspection (low-mag, high-mag)
  • SEM inspection
  • Electrical Testing  (bench-top)
  • Cross-sectioning 
  • Deprocessing
  • Energy Dispersive Spectroscopy (EDS), Elemental Analysis
  • Custom solutions available
Get The Info You Need

Ready To Solve Your Problem?

Here's how we do it.

Schedule Consultation

Schedule Consultation

Discuss your problems in depth with an experienced engineer to identify your specific needs and services.

Receive a Quote

Receive a Quote

Typically, in one work day after the consultation you will receive a reliable quote to solve your problem.

Problem Solved

Problem Solved

Send PO and/or parts and we get started. You receive the data you need to enable you to solve the problem.