Many failure analysts say that no two projects are exactly alike. Every defect is subtly shaped by its surrounding circumstances – the type of process used to construct the device, the environment in which the device was used, and the application that the device is used in can all contribute to the nature of the malfunction. Though they may be relatively unique in their specifics, most IC defects can still be classified with fairly broad brushstrokes; indeed, these classifications are vital to the failure analysis customer, as they often determine the type of corrective action that must be taken.