Detecting and isolating a failure in an integrated circuit is no easy matter. There are many techniques used in failure analysis and choosing the right one is an art as well as a science. Sometimes we may need to use many techniques both for better detection as well as independent corroboration so that we can be sure of the results of a particular test. But all tests fall into one of two categories - destructive testing, and non-destructive testing. In this article, we look at why non-destructive testing is so important and what methods fall into this type of test.

Integrated circuits function as discrete units and a final assembly consists of many different types of ICs placed together. Each can be sourced separately and manufactured elsewhere. This is one of the reasons, they need to be packaged into individual segments with all the IC components sitting safely inside. They're also very delicate and must be protected which is another reason why they are sealed off from the outside world. Failure analysis of such ICs needs physical access to packaged components which isn't possible as long as they're inside their protective casing. Therefore, one of the first steps while performing the actual analysis is to extricate the circuits of interest from their outer covering. This procedure is called Integrated Circuit Decapsulation.

When a complex electronic component malfunctions, it's important to understand what exactly has gone wrong and more importantly, why. The entire branch of quality control revolves around reducing error rates in manufacturing. Faulty chips not only lose money directly but can also lead to unforeseen lawsuits. In order to get a clear idea of the problem, misbehaving components are sent for inspection to failure analysis labs. A failure analysis laboratory is a place which is dedicated to finding out why certain chips are defective. Over the years, the field of forensic engineering has evolved to a point where there is a systematic way of drilling down to the root of the problem. In this article, we look at the features of IC failure analysis labs and what services they provide.

Of all the various failure analysis techniques, microthermography is perhaps the most important. If we could do away with all procedures and retain just one which can tell us the most about a chip, we'd like to see the thermal output and which areas are misbehaving. Because of this, there is more than one technique to get the "heat map" of a chip and last week we saw how liquid crystals can be used for this purpose. But liquid crystals suffer from some major flaws and recently, failure analysis using fluorescent microthermal imaging (FMI) is coming to the fore as a compliment. In this article, we see why FMI is important, how it works, and how it's used.

One of the basic requirements of electronic failure analysis is the ability to actually view a detailed close up of the Integrated Circuit (IC) at the point which needs to be tested. Though techniques such as acoustic microscopy are invaluable, they must be used in conjunction with a first class real life image. Such a combination of techniques is common in the failure analysis of ICs. Failure analysis using Scanning Electron Microscopy is the technique that is used for obtaining this detailed image. In this article, we look at why and how electron microscopy services are able to generate such intense representations.

Often, it is necessary to determine the integrity of the materials which make up an integrated circuit. This is a fundamentally different type of test as compared to seeing the internal structure or trying to understand its makeup using emission spectroscopic techniques. There are many different failure mechanisms that can be tested for and failure analysis using Scanning Acoustic Microscopy is a common way of finding structural defects. In this article, we learn more about using scanning acoustic microscopy for electronics failure analysis, how it works, and what data we can obtain by using it.

Failure analysis using decapsulation occupies a prominent position among failure analysis techniques for integrated circuits. However, a failure analysis engineer must use caution in using decapsulation as it will render the package useless and other techniques useless as well. In that sense, failure analysis using decapsulation belongs after microscopy or radiography so that the testers know which decapsulation technique to use. Decapsulation refers to taking an integrated circuit apart to examine the components. Taking the package apart may destroy parts of the package that require inspection. So, failure analysis using decapsulation means already knowing what to examine. Decapsulation will use any of several means to open the package. These range from simply prying the substrates apart to laser or jet etching. Some IC decapsulation processes call for subjecting the package to heat and then grinding the components apart. This technique will destroy bond wires but preserve the die, whereas the etching processes (laser etching, manual etching or jet etching) will usually destroy the die. Failure analysis using decapsulation by means of manual etching subjects the package to corrosive acids to remove the plastic material that covers the die. Various acids may be used in this process and sometimes the acid…

  Are you searching for the services of a semiconductor failure analysis lab for help with electronics failure analysis and root cause analysis? Insight Analytical Labs (IAL) is a full-service electronics failure analysis lab.  Call us to speak with a semiconductor failure analysis expert in our lab at (719) 570-9549. Semiconductor Failure Analysis - Enhancing Reliability Semiconductor failure analysis occupies a prominent position among high tech fabricators. Even the most sophisticated ICs fail, and when they do, it’s critical that engineers and fabricators discover the root causes of the failure, so as to avoid the same issues in subsequent designs. Semiconductor analysis can, therefore, enhance semiconductor reliability by addressing observed shortcomings in design and fabrication and then avoiding them in the future. Semiconductor failure analysis initially involves pinpointing the nature of the failure. Semiconductor failures can be broadly grouped into two categories: functional failures and parametric failures. A functional failure means the device failed in its intended function, while parametric failures mean the device’s function lies outside the specifications for a measurable characteristic.  

Advances in the electronics industry are always increasing and failure analysis is as important now as it has ever been. It is especially critical in the semiconductor industry where product line problems must be resolved rapidly and effectively. Failure analysis is further complicated as semiconductors are continually being scaled down and materials are being changed, thereby making a quality failure analysis more difficult.

With a variety of test equipment pieces available at their fingertips, semiconductor failure analysis services may very well be considered modern day, high-tech “surgeons.” In the semiconductor industry, product lines are a manufacturer’s lifeblood. When a product line is “frozen” for a product defect, semiconductor failure analysis becomes the necessary problem-solving tool to “unfreeze” the line. A failure analysis performed accurately and rapidly ultimately saves a manufacturer time, money, and a precious thing known as reputation.

Electrical failure analysis is the key to reducing liability and associated costs to your electronics business. In essence, electronic failure analysis is high-tech damage control and at the end of the day, your customers will thank you. However, if left unchecked, the slightest change in engineering, materials, and/or processes can cause ripple effects throughout your supply chain, setting a company back weeks in engineering time and thousands of dollars in materials and lost revenue.