High Resolution X-ray imaging is used in identifying process failures in electronics products.

High Resolution X-ray imaging is used in identifying process failures in electronics products.
For PCBA we inspect for inner layer misalignment and bad via plating.
For IC's we inspect for die attach coverage and wire bonding problems.
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Specializing in Electronic Failure Analysis. ISO 9001:2008 Certified!
Insight Analytical Labs, Inc.
2430 Waynoka Road
Colorado Springs, CO 80915-1612
719-570-9549
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