IAL's Electronic Failure Analysis Services

Real Time High Resolution X-Ray Inspection

Real Time X-Ray InspectionAlternate names

2D X-ray, X-ray microscope, MIL-STD-883, Method 2012

Overview

X-ray inspection is a non-destructive technique that provides detailed information about the internal structure of a component without taking it apart.  The tool at IAL is “real-time” meaning that it provides images instantly without film and provides the result as a digital image.  In addition, the tool has the ability to move the sample and rotate it to inspect at a variety of angles and perspectives during a single inspection.

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Integrated Circuit (IC) Failure Analysis Services

You can have a positive integrated circuit (IC) failure analysis experience. We provide mechanical as well as electrical FA to help identify the failure mechanism. Our experience will then help identify the possible root cause. From discrete components to integrated circuits, we'll help you solve your problems.

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Printed Circuit Board Electronic Failure Analysis

Whether measuring plating thickness, cross sectioning vias, identifying foreign materials or finding defects in the board, IAL has the expertise and equipment to isolate the cause of failure.

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Emission Microscopy Electronic Failure Analysis

Emission microscopy (EMMI) is an efficient optical analysis techniques used to detect and localize certain integrated circuit (IC) failures.

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Scanning Acoustic Microscopy Failure Analysis

Acoustic imaging is both science and experience. IAL can provide you with both to ensure a proper reading of the images.

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Scanning Electron Microscopy Electronic Failure Analysis

Scanning Electron Microscopy (SEM) is a standard technique capable of imaging structures and materials at resolutions well beyond the limits of optical microscopy.

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Deprocessing Electronic Failure Analysis

IAL uses mechanical, chemical, and dry deprocessing methods to obtain the results you desire.

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RoHS Auditing and Compliance Certification Electronic Failure Analysis

Need help with RoHS Auditing and Compliance Certification services?  The IAL failure analysis lab uses mechanical, chemical, and dry deprocessing methods to obtain the results you desire.

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High Resolution X-Ray Electronic Failure Analysis

High Resolution X-ray imaging is used in identifying process failures in electronics products.

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Liquid Crystal & FMI Electronic Failure Analysis

Liquid crystal (LX) and Fluorescent Microthermal Imaging (FMI) are efficient optical analysis techniques used to detect and localize certain integrated circuit (IC) failures. They are non-invasive techniques performed from either the front or back of devices.

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