You can have a positive FA experience. We provide mechanical as well as electrical FA to help identify the failure mechanism. Our experience will then help identify the possible root cause. From discrete components to integrated circuits, we'll help you solve your problems.

Whether measuring plating thickness, cross sectioning vias, identifying foreign materials or finding defects in the board, IAL has the expertise and equipment to isolate the cause of failure.

Emission microscopy (EMMI) is an efficient optical analysis techniques used to detect and localize certain integrated circuit (IC) failures.

Acoustic imaging is both science and experience. IAL can provide you with both to ensure a proper reading of the images.

Scanning Electron Microscopy (SEM) is a standard technique capable of imaging structures and materials at resolutions well beyond the limits of optical microscopy.

IAL uses mechanical, chemical, and dry deprocessing methods to obtain the results you desire.

Need help with RoHS Auditing and Compliance Certification services?  The IAL failure analysis lab uses mechanical, chemical, and dry deprocessing methods to obtain the results you desire.

High Resolution X-ray imaging is used in identifying process failures in electronics products.

Liquid crystal (LX) and Fluorescent Microthermal Imaging (FMI) are efficient optical analysis techniques used to detect and localize certain integrated circuit (IC) failures. They are non-invasive techniques performed from either the front or back of devices.