Equipment List And Usages
• Hitachi 3200/3500 SEM |
• Liquid Crystal capability |
•
EDAX Phoenix Pro EDS |
• FEI 800 Focused Ion Beam
system* |
•
Sonix Acoustic Microscope |
•
Schlumberger E-Beam prober* |
•
CR Technology Real-Time X-ray |
•
Hypervision Visionary-II LEM* |
•
Wet chemistry Lab |
•
NSC Plastic Package Decapper |
•
PNI Atomic Force Microscope |
•
All-digital photography equipment |
•
March Jupiter-II RIE |
•
High-speed and low-speed diamond saws |
•
March CS-1701F RIE |
•
Potted Cross Section Capability |
• Allied
High Tech lappers
–Parallel
lapping capability |
• Bench
top equipment
–Curve
Tracers
–Logic
Analyzer
–Data
Generator
–Digital
Oscilloscope, etc. |
•
Signatone Motorized Probe Station |
Equipment Usage
• Acoustic Microscopy (aka CSAM): Uses sound waves to form an image of the inside of the specimen (much like ultrasound analysis used by hospitals). Complements X-ray as it is useful in identifying cracks, delaminations, voids, and other workmanship issues.
• Atomic Force Microscope (AFM): Scans a device with a 10-nm tip, providing a 3D profile of the topography.
• E-Beam Prober : Used mainly for ICs, and is basically a SEM, but it can measure the digital values of the metal traces on the IC. Used mainly for failure analysis to see which lines have bad signals on them.
• Focused Ion Beam (FIB): Uses a gallium beam to etch away materials, used mainly for ICs. Can be used to “cut and paste” metal lines (editing actual IC devices by cutting and re-routing metal lines) and make cross sections.
• Liquid Crystal (L/X): Temperature sensitive liquid crystals are applied to the surface of the sample while the sample is in its failing state. Hot spots cause the L/X to transit making the identification of the failing area known to the analyst.
• Photo-Emission Microscopy (PEM or LEM): Another technique used to isolate the area that is failing. While the device is in the failing mode, night vision technology is used to inspect the sample for emissions. Certain failure mechanisms (leaky oxides, diode breakdowns, and hot carrier injection for example) will emit light in the visible wavelength, which is detected by the PEM.
• Reactive Ion Etcher (RIE): Removes oxide layers and organics from integrated circuits (IC).
• Real-Time X-ray (RTX): Provides real-time inspection of ICs, discretes, semiconductors, PCBs, and PCAs for workmanship issues. Very popular for BGA solder bump analysis (provides information on bump shape, solder voiding, alignment and other key factors). Also an excellent tool for die attach analysis.
• Scanning Transmission Electron Microscopy (STEM): Uses a SEM to provide a detailed image of an IC.
• Thermal Microscopy : Utilizes an IR-camera to thermally map the surface of an IC, package, or board. |
