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Semiconductor and Electronic Failure Analysis Blog

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Emission Microscopy Failure Analysis for Electronics

So you've taken your circuit board dreams and created the next killer black box technology that everyone's going to be talking about soon. However, the only problem is that things are still a bit off when it comes to making it work the same way each time. While forcefully striking your masterpiece may be a great way to jog its memory about what it's supposed to be doing, if you're not sure your investors or customers will want to rely on inconsistent performance, you need electronic failure analysis with a fast turnaround.

With a huge range of techniques and methods for understanding why your component's construction didn't cause operation characteristics in line with theoretical values, reliable failure analysis is a much quicker way to find out where you went wrong. When circuit boards are in play, any number of semiconductors, ICs, or improperly rated components can be the culprit causing your problems.

Unfortunately, with the number of individual parts present in any specialized circuit, not to mention the nanometer scale of many parts, most DIY or in-house troubleshooting attempts simply end up releasing a lot of magic smoke without really fixing anything.

By using emission microscopy to get a complete, luminous picture of where defective junctions, leakage currents, and other common IC defects are located, it's simple to form a plan of attack for design modifications. Non-invasive Scanning Acoustic Microscopy (SAM) can sample interior spaces for voids, cracks, or delamination. As a last resort, dry deprocessing specialists know how to open any package to get to the heart of microscopic trouble. When you're tired of testing and not getting anywhere, call Insight Analytical Labs, Inc. to gain some understanding of the reasons behind your product's failures and how to avoid them in the future.

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