Using FIB for Wafer Lot acceptance and Design Verification
- Created: Tuesday, 31 March 2015 19:42
- Written by Scott Griffith
FIB (Focused Ion Beam) technology has certainly come a long way since its introduction in 1975. I recall very well the first encounter I had with the technology as a young ASIC designer in the late 80s. It seemed the most magical thing I had ever encountered: the ability to rework semiconductor devices, not only by being able to cut metallization lines (to correct shorts, for example, as had been done previously on a mechanical probe station), but also to add new conductive paths. FIB literally provided a designer the ability to add what are essentially blue wires to correct bugs in a design, as could be done with a board level product. FIB truly opened a whole new world.